Vacuum Assemble System
Vacuum Assemble System is a machine to align and laminate QDCF substrates and CMOS display substrates from the upstream machine in a vacuum chamber.
- High Precision and Low Deviation Lamination Technology (According to the most suitable substrate chuck of D-PSC and LVC)
- OGA Positioning Control (With the optimum alignment technology)
- Auto Recipe Change and High Availability (Over 95%)
- Cell Precision Optimum Feed Back Technology
- Chip to Chip or Wafer to Wafer or Chip to Wafer
- Applicable for 8”Wafer and minimum for 0.12”Chip
Brand AIMECHATECH Co., Ltd, Japan
Added to your inquiry
VAS
Vacuum Assemble System