Wafer Warpage Measurement

warpage_measure
Wafer Warpage Measurement is used for measuring warpage to check whether the product meets customer’s requirement. 

Application

Wafer Warpage Measurement can be used for any semiconductor process (front-end/back-end/package…etc.)

Benefits

Wafer Warpage Measurement can control the difference of wafer warpage, and avoid problems which may cause loss to happen through the process.

Specification & Features

  • Applied for 8” & 12”Wafer
  • Measure Head Measurement Repeatability: ±0.5um
  • Robot warpage capability: +6 mm/-6mm
  • Applied Wafer Thickness: 430~980um
  • 360° Measurement
  • Mininum measurement setting angle for 1°
  • Machine Measurement Repeatability: ±1um
  • Applied for E84 SPEC & SECS/GEM SPEC