Wafer Flip AOI System
Wafer Flip AOI System is used for sorting & flipping incoming materials. In addition, it is able to check the foreign materials on the surface of the wafer and glass cracking by AOI.
Specification & Features
- Applied for 12"" Wafer
- Warpage >±5mm pre-inspection
- V notch positioning & Flat Wafer positioning by 2D barcode scanning
- OCR Wafer ID Comparison Function
- Wafer double/tilting detectable
- Defect Inspection Type: Wafer Scratch, Crack, Broken, Foreign Material, Un R/L /Residue
- Defect Inspection Capacity>10um
- Equipped with SECS/GEM
Added to your inquiry
WF-1000
Wafer Flip AOI System