Wafer Thickness Measurement

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Wafer Thickness Measurement
Wafer Thickness Measurement is used for measuring thickness to check whether the product meets customer’s requirement. 

Application

Wafer Thickness Measurement can be used for any semiconductor process (front-end/back-end/package…etc.)

Benefits

Wafer Thickness Measurement can control the difference of wafer thickness, and avoid problems which may cause loss to happen through the process.

Specification & Features

  • Applied for 8” & 12” Wafer
  • Measure Head Measurement Repeatability: ±0.5um
  • Robot warpage capability: +6 mm/-6mm
  • Applied Wafer Thickness: 430~980um
  • 360° Measurement
  • Minimum measurement setting angle for 1°
  • Machine Measurement Repeatability: ±1um
  • Applied for E84 SPEC
  • Applied for SECS/GEM SPEC
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