Wafer Edge Grinding Machine

WEM-1000
Wafer Edge Grinding Machine
Wafer Edge Grinding Machine is used for removing burrs from the edge of the wafer.

Benefits

Automatically wafer edge grinding and burr inspection to reduce manpower requirement.

Specification & Features

  • Applied for 8" & 12" round type silicon wafer and 8" flat type silicon wafer.
  • 8" cassette & 12" FOUP can be shared by changing the fixture of the L/P.
  • Grinding parameters cab be set by recipe.
  • Burrs>100um can be detected after grinding.
  • It is equipped with Maping Slot, Wafer Cross-slotting and Double Wafer Slotting detection function.

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